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Modeling and Simulation for Microelectronic Packaging Assembly

Manufacturing, Reliability and Testing

Udgivet af John Wiley & Sons Inc

Bogdetaljer

  • Indbundet
  • 576 sider
  • Engelsk
ISBN 9780470827802
Om denne bog

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability…

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Bogdetaljer
Forfatter Yong Liu, Shen Liu
Forlag John Wiley & Sons Inc
Kategori Produktionsteknik
ISBN-13 9780470827802
EAN 9780470827802
Format Indbundet
Sprog Engelsk
sider 576
Undertitel - Manufacturing, Reliability and Testing
Produktbeskrivelse
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

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